ʻO Kina ka mea hoʻolako 5-100 Micron ʻO nā Bubble Bubbles Hollow Materials Insulation Materials Hollow Glass Beads Microspheres
High-hana hollow aniani microspheres, ka maoli density 0.25 ~ 0.60g/cm3, ka nui o ka particle ma waena o 2 ~ 125μm, ka compressive ikaika ma 5 ~ 82MPa (725 ~ 12000PSI), ka thermal conductivity o 0.05340-0.100040W / m.k.ʻO nā huahana he māmā ke kaumaha, nui, haʻahaʻa haʻahaʻa thermal conductivity, kiʻekiʻe compressive ikaika a me nā ʻano wai wai maikaʻi.
Nā Pono Huahana:
- ʻAno nui / ʻano ʻoiaʻiʻo: 55 a 65%
- ʻO ke ʻano: ka pauka kahe keʻokeʻo
- ʻO ka pololei a me ka paʻa o ka nui * Maikaʻi
- ʻAʻole hiki ke hoʻoheheʻe ʻia i ka wai, kūpaʻa wai a me ka alkali
- Kūpaʻa: 600 °C ke hoʻoluliluli ʻia
- ʻO kaʻailaʻaila: 0.20 ~ 0.65g / cm3
- Laulā wela laulā: mai -20 °C ~ 500 °C haʻahaʻa wela
- Waiwai PH: 8.0 ~ 9.5
- Dielectric mau: 2-3
ʻIkepili Prodcut
| Ture Density | ʻAiʻi Nui | Partikel Szie | Ka Paʻi Paʻi | Ola | Holoi | Māmā |
| 0.18-0.60g/cm3 | 0.1-0.34g/cm3 | D50≤20~70μm;D90≤30~125μm | 4~125MPa/500-18000PSI | ≥90% | ≥92% | ≤0.5% |
Palapala noi
1.Building mea i loko o ke kula e hoʻohana ana i kona thermal insulation hopena, nui no ka reflective insulation uhi, putty, adhesives, etc.;
2.Composite mea nui haʻahaʻa haʻahaʻa a me ka maʻalahi o ka hoʻohana ʻana i kāna mau hiʻohiʻona hana, e like me ka hoʻohaʻahaʻa ʻana i ka mea, e hōʻemi ana i kāna mau ʻāpana kaumaha e hoʻomaikaʻi i ka maikaʻi o nā mea;
3.Aerospace navigation me ka hoʻohana ʻana i kona kaumaha māmā, nā hiʻohiʻona ikaika compressive kiʻekiʻe o ka hana ʻana o nā mea māmā;
4.ʻO kaʻaila a me ke kinoea eʻimi i ke kahua o ka wai wili i hoʻohanaʻia ma keʻano he haʻahaʻa haʻahaʻa a me ka haʻahaʻa haʻahaʻa.
HoʻopiliʻIkepili
- He Pahu(0.09m3): ʻO 41.5×41.5x52cm kēlā me kēia pahu i loko.13/15/22kgs no ka pahu pahu.
- B Pahu(0.125m3): ʻO 50x50x50cm kēlā me kēia pahu i loko.20/22/30kgs no ka pahu pahu.
- Nui ʻeke nui: 89x89x220cm,Nui Pallet: 100x100cm.180/280/350/500/550/750kgs no ka pahu pahu.
