nūhou

1. Koi koʻikoʻi mai nā kikowaena AI a me nā kikowaena ʻikepili

ʻO nā kikowaena AI ke kumu nui o ke koi hoʻonui nolole olonā aniani dielectric haʻahaʻa. Hilinaʻi ke aʻo ʻana a me nā kaʻina hana hoʻomaopopo AI i ka hoʻololi ʻikepili nui, e pono ai ka hoʻohana ʻana i nā PCB helu kiʻekiʻe a me nā ʻenehana interconnect wikiwiki; kau kēia i nā koi koʻikoʻi ma nā waiwai dielectric a me ke kūpaʻa dimensional o nā mea. Me ka hoʻohana ʻana i nā ʻenehana e like me PCIe 6.0 a me 224G optical modules, ua neʻe nā koi hana no nā laminates i uhi ʻia me ke keleawe (CCL) i nā kikowaena AI mai ka low-loss maʻamau i nā ultra-low-loss (ULL) a me nā hyper-low-loss (HLL) mau māka, e hoʻokele pololei ana i ka piʻi ʻana o ke koi no nā māka like o ka lole fiber aniani low-dielectric. Hōʻike ka ʻikepili mākeke ʻo ke kumukūʻai o nā CCL i nā kikowaena AI he 5 a 8 mau manawa o nā kikowaena kuʻuna. Ma ke ʻano he mea maka kumu, ua ʻike ʻia ke kumukūʻai o ka lole fiber aniani low-dielectric kiʻekiʻe i 320,000–350,000 RMB/ton i ka makahiki 2025—he piʻi 20% mai ka hoʻomaka ʻana o ka makahiki—me kekahi mau hiʻohiʻona kikoʻī e ʻike nei i nā piʻi kumukūʻai e like me 250%–300%.

E pili ana i ka ʻokoʻa o ka lako-koi, i hoʻoulu ʻia e ka piʻi mau ʻana o ke koi mai nā mea kūʻai aku AI ma lalo a me nā palena ma ka hiki ke hana lole uila kiʻekiʻe ma luna, ua hāʻule nā ​​​​pae palekana o ka lole uila kiʻekiʻe ma nā mea hana CCL nui i ka lako ma lalo o hoʻokahi pule, e hōʻailona ana i kahi haʻahaʻa mōʻaukala. No ka hoʻokō ʻana i ke koi no nā huahana kiʻekiʻe, ua koi ʻia nā mea hana CCL e hoʻokiʻekiʻe i nā kumukūʻai kūʻai. Ma muli o nā ʻano kumukūʻai o kēia manawa a me ke ʻano o ka lako-koi, ua mākaukau ka lole fiber aniani kiʻekiʻe e ʻike i ka piʻi like ʻana o ka nui a me ke kumukūʻai.

2. Nā Koina Hana no ka Pūʻolo Chip Kiʻekiʻe

ʻO ka ʻenehana hoʻopili holomua no nā ʻāpana AI e hōʻike ana i kahi hiʻohiʻona noi koʻikoʻi nolole olonā aniani dielectric haʻahaʻa. I ka holomua ʻana o nā kaʻina hana hana chip i ka node 3nm a ma ʻō aku, ke hoʻomau nei ka piʻi ʻana o nā mānoanoa o ka ʻōpala. Hoʻokau nā substrates ABF—nā mea lawe koʻikoʻi e hoʻopili ana i nā chips i nā PCB—i nā koi koʻikoʻi loa i nā waiwai dielectric a me ka maʻemaʻe o kā lākou mau mea kumu. ʻO ka maʻamau, pono e hāʻule ka dielectric constant i loko o ka pae 3.0–4.0 (ma 1 MHz), ma muli o ke alapine hana, ʻoiai pono e hoʻomalu ʻia ka dissipation factor (Df) ma waena o 0.005 a me 0.010 (ma 1 MHz); ʻo nā noi alapine kiʻekiʻe (e like me 5G a me nā kamaʻilio wikiwiki) e koi paha i nā waiwai haʻahaʻa (<0.005). Eia kekahi, no ka hoʻokō ʻana i nā pono ʻōpala kiʻekiʻe, pono nā mea e kaulike i kahi Coefficient of Thermal Expansion (CTE) haʻahaʻa me ke kūpaʻa wela kiʻekiʻe e pale aku i ka haki ʻana o ke kaapuni i hoʻokumu ʻia e ke kaumaha wela. Ua kū mai ka lole olonā Quartz (i ʻike ʻia hoʻi ʻo "Q-fabric" a i ʻole "lole uila hanauna ʻekolu") ma ke ʻano he mea makemake ʻia no nā substrates ABF ma muli o kona dielectric constant haʻahaʻa (2.2–2.3), ka liʻiliʻi o ka pohō dielectric (Df o 0.001–0.0005), a me ka hiki ke kū i nā mahana hana lōʻihi o 600°C a ʻoi aku paha.

ʻO ka ulu wikiwiki ʻana o nā hoʻouna ʻāpana AI honua e hoʻokele pololei ana i ka hoʻonui ʻana o ke koi no ka lole quartz. Wahi a nā wānana a Future Think Tank, manaʻo ʻia ka mākeke lole quartz honua e hōʻea i $3.127 biliona ma ka makahiki 2031, me ka helu ulu makahiki hui (CAGR) o 23.30%. Hōʻike kēia wānana i ke ʻano piʻi o ke koi, e hilinaʻi ana i ka piʻi mau ʻana o nā hoʻouna ʻāpana AI a me ka hoʻohana nui ʻana i nā ʻenehana hoʻopili holomua. Eia kekahi, ʻo ka hoʻomohala ʻana o nā kahua AI hanauna hou—e like me "Rubin"—e kūlike me nā kaʻina hana hana chip 3nm a i ʻole N4 a hoʻohana i ka hoʻopili substrate nui CoWoS-L. Hoʻohui kēia mau kahua i ʻewalu mau puʻu HBM4 e hoʻokō i nā koi no ka bandwidth kiʻekiʻe a me ka interconnectivity, e hāʻawi ana i kahi hopena kūpono no ka hoʻonui ʻana i ka mana helu. ʻO nā koi no nā substrates nui loa a me ka hana koʻikoʻi e hoʻonui hou aku i ke koi no nā mea maka lole quartz, e hoʻokele ana i ka ulu ʻana o nā lole aniani Low-Dk (low dielectric constant) i nā dielectric constants haʻahaʻa a me nā ʻano pohō haʻahaʻa.

3. Nā hopena ulu synergistic ma nā ʻāpana he nui

Ma waho aʻe o ka ʻāpana koʻikoʻi o ka mana helu AI, ʻo ke koi mai nā kahua e like me ke kamaʻilio ʻana 5G/6G a me nā mea uila mea kūʻai kiʻekiʻe e hoʻokele nei i ka ulu synergistic me AI. ʻO ka ulu ʻana mai ka nalu millimeter 5G (24-100 GHz) a i ka ʻenehana terahertz 6G (alapine alapine ma kahi o 100 GHz–3 THz) e pili ana i nā alapine kiʻekiʻe e hoʻolilo i nā lako kamaʻilio i mea maʻalahi loa i ka nalowale o ka hōʻailona. ʻOiai ʻo ka wā 5G e koi ana i ka lole fiberglass ultra-low-loss, ʻo ka wā 6G e kau i nā koi koʻikoʻi no ka dielectric constant (Dk) a me ka dissipation factor (Df): Pono e hāʻule ʻo Dk i 2.0–3.0 (ma >100 GHz), a pono e emi ʻo Df mai ke kūlana 5G o 0.003–0.005 (ma 10 GHz) a i 0.0001–0.0007 (ma 100 GHz), e hana ana i kahi pono no ka lole quartz "low-loss loa". Ma ka ʻāpana uila mea kūʻai aku, ua hoʻohana ka iPhone 17 i ka lole haʻahaʻa CTE (coefficient of thermal expansion) a me ka lole dielectric haʻahaʻa i hāʻawi ʻia e Honghe Technology e hoʻoponopono i nā pilikia e like me ke kūʻai ʻana i ka chip A10 Pro 3nm, ka pale ʻana i ka warping i nā motherboards density kiʻekiʻe, a me ka hoʻēmi ʻana i ka nalowale o ka ikehu i nā hōʻailona 5G/Wi-Fi 7 alapine kiʻekiʻe. Hōʻike kēia neʻe i ka hoʻololi wikiwiki ʻana o nā lole uila kiʻekiʻe mai nā noi ʻoihana i nā uila mea kūʻai nui, e hoʻokele ana i ka piʻi ʻana o ke koi mea a me ka hoʻolōʻihi ʻana i nā manawa alakaʻi lawe. ʻO ka hoʻonui akamai o nā uila kaʻa e kōkua pū ana i ka hoʻonui ʻia o ke koi; pono ka hoʻokele autonomous holomua (Level 3 a ʻoi aku) i nā sensor ADAS he nui a me nā radar alapine kiʻekiʻe. Koi kēia mau ʻōnaehana i ka paʻa o ka hoʻoili hōʻailona, ​​​​ka hilinaʻi o ka hui solder lōʻihi, a me ke kūpaʻa o ka automotive-grade e kūʻē i ka haʻalulu, ka wela, a me ka haʻahaʻa. No laila, ua lilo nā mea papa kaapuni e hōʻike ana i nā constants dielectric haʻahaʻa, ka pohō dielectric haʻahaʻa, ke kūʻē ʻana o CAF (conductive anodic filament), a me ka CTE haʻahaʻa i koho makemake ʻia no nā ʻōnaehana hoʻokele akamai holomua, e hoʻolalelale hou ana i ka hoʻohana ākea ʻana o ka lole fiberglass kiʻekiʻe. Ua hōʻike nā wānana o ka ʻoihana e hiki i ka mākeke honua no ka lole uila low-dielectric-constant ke hōʻea i 3.76 biliona yuan ma ka makahiki 2031, e ulu ana ma ka nui o ka makahiki he 10.1%—he ʻano i hoʻokele nui ʻia e ka hui ʻana o ke koi ma nā ʻāpana like ʻole.

ʻO ka palena hope loa o ka hoʻonui ʻana i ka mana kamepiula e pili ana i ka uhaki ʻana i nā palena kino o nā mea. Mai nā PCB ultra-low-loss i hoʻohana ʻia i nā kikowaena AI a me ka lole quartz i loko o ka pūʻolo holomua a hiki i nā laminates kiʻekiʻe no nā mea uila mea kūʻai aku a me ka hoʻokele autonomous, ke komo nei ka lole fiberglass low-dielectric i kahi "manawa i ʻike ʻole ʻia." I waena o kahi ʻāina lako-koi i hōʻike ʻia e ka piʻi ʻana o ka nui, ka hoʻonui ʻana i nā kumukūʻai, a me ka nele o ka mana, ua puka mai kēia "lole uila" māmā ma ke ʻano he hoʻokahi o nā ʻāpana ulu pahū loa e hoʻopili ana i nā ʻōnaehana lako AI a me nā ʻenehana kamaʻilio alapine kiʻekiʻe o ka hanauna e hiki mai ana.